SiLab Volume II
High-Speed Signal Propagation: Advanced Black Magic
2.1 Via Inductance
A general theory of pcb via inductance, confirmed by direct measurements taken on a giant scale model, reveals the importance of having good interplane connections near those spots where high-speed signals traverse vertically through your layer stack. (Measured data)
2.2 Serial Link Architecture
See typical signals inside a working multi-gigabit serial link. Hear about practical tradeoffs associated with differential trace geometry, connector crosstalk, and pcb vias. (Live demonstration: RocketIO at 10 Gb/s) Features and specifications shown may differ from those presently available.
2.3 Serial Link Budgeting
A link attenuation budget focuses your attention on the parts of your system that cause the greatest signal degradation, like backplane connectors, pcb trace losses and DC blocking capacitors. (Worked example: RocketIO at 6.25 Gb/s) Features and specifications shown may differ from those presently available.
Choose from three volumes
accompanies the class High-Speed Digital Design
accompanies the class Advanced High-Speed Signal Propagation
accompanies the class High-Speed Noise and Grounding